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The continuous advancement of compound semiconductor technology and the research and innovation of key materials play an irreplaceable role in multiple high-tech applications such as 5G communication, power electronics, and optoelectronic devices. This forum will focus on the latest research progress of compound semiconductor materials, explore their challenges and achievements in preparation processes, performance optimization, cost control, etc., share the three-dimensional integration era of material construction, and promote the high-quality development of the compound semiconductor industry.

Preparation and Application of Heterogeneous Bonding Materials

Key Materials in Photolithography: New Developments in Masks and Photoresists

Preparation technology of large-sized SiC, LiNbO3 and other substrates

Parallel Forum 2

The technological progress and innovation of core equipment are important foundations for promoting the development of the semiconductor industry. With the increasing demand for high-performance and high reliability compound semiconductor devices in the industry, this forum will focus on the key equipment in the compound semiconductor manufacturing process, explore its latest technological progress, application challenges, and future development trends.

High precision non-destructive cutting of compound semiconductor materials

The influence of groove gate oxygen anisotropy on the performance of silicon carbide power devices and optimization schemes

Application and technical bottlenecks of compound measuring equipment

Difficulties and challenges in compound etching process equipment

Design and Manufacturing Technology of Compound Epitaxial Growth Equipment and Its Prospects

Compatibility application of compound semiconductor backside alignment lithography process

Application of Cu/Ni/SnAg/Au/TSV multi metal wet electroplating technology in third-generation semiconductor multi scenario

Parallel Forum 3

EDA tools and ecosystems are undergoing significant innovation driven by AI and machine learning, which not only accelerates the process of chip design and verification, but also promotes the boundary expansion of system design and device modeling technology. Especially in the fields of optical communication and display, power and RF applications, customized EDA tools are becoming the key to improving design efficiency and product quality. They can effectively cope with the increase in design complexity, significantly shorten product development cycles, reduce costs, and create greater value for enterprises.

Frontiers of Intelligent Design (AI and Machine Learning Empowering EDA Innovation, etc.)

Chip Design and Verification

System Design and Device Modeling

EDA tool applications (optical communication and display, power and RF applications, etc.

Parallel Forum 4

As an industrial accelerator in the information age, optoelectronic technology is driving innovative development in multiple fields such as communication, sensing, healthcare, energy, and computing at an unprecedented speed. From high-speed fiber optic communication to precision laser processing, from biomedical imaging to renewable energy conversion, it has shown enormous market potential and broad application prospects. This forum will focus on the latest developments in optoelectronic technology, covering key areas such as materials science, device design, and system integration, and explore the path of technological innovation and industrial upgrading.

Optical Communication and Data Center Applications

Progress and Prospects of CPO

Progress and Challenges in Chip Luminescence

Lidar application

Optoelectronics and Neural Networks

Parallel Forum 5

From electric vehicles to renewable energy systems, from industrial automation to household appliances, efficient and reliable power electronic devices are of great significance in reducing energy consumption and carbon emissions. This forum will focus on the latest developments in power electronics technology, including SiC/GaN and new power semiconductor materials, advanced topology structures, and efficient converter designs.

GaN power integration technology

SiC power device technology and prospects

Power module technology

Packaging materials and technology

Application of Power Electronic Devices

New Material Power Device Technology

Parallel Forum 6

Wireless electronic technology, as a key bridge connecting future societies, is constantly expanding its boundaries in wireless systems and communication technology, electronic applications, microwave and millimeter wave integrated circuits, terahertz science and technology, wireless energy transmission and energy interconnection, and radio frequency energy application technology. With the development of 5G and even 6G communication technology, the demand for higher frequencies and larger bandwidths presents new challenges and opportunities for wireless electronic technology.

Wireless Systems and Communication Technology

Application of Wireless Electronic Technology

Microwave millimeter wave integrated circuits/chips/devices

Terahertz Science and Technology

Wireless energy transmission and energy interconnection

RF energy application technology

Parallel Forum 7

From OLED, Micro LED to quantum dot displays, advanced display technologies continue to emerge, bringing revolutionary changes to multiple fields such as consumer electronics, virtual reality, and in car displays. This forum will focus on the latest developments in display technology, including innovative achievements in materials science, manufacturing processes, system integration, etc. It will also delve into the challenges and opportunities of advanced display technology in different application scenarios, such as high-resolution display, flexible display, transparent display, and other cutting-edge topics.

Full color single-chip integrated display technology

Large scale epitaxial technology

Epitaxial growth technology of red light materials

Ultra small Micro LED chip technology

Large scale wafer level heterogeneous bonding technology

High pixel density drive integration technology

Micro LED intelligent display application

Parallel Forum 8

Heterogeneous integration technology, as a key driving force for the future development of the semiconductor industry, is leading the transition from a single material system to multi material and multifunctional integration. This technology not only significantly improves the performance and functional density of chips, but also provides new possibilities for achieving low-power and high-efficiency system level integration.

Frontier exploration of heterogeneous integration technology for compound semiconductor platforms

Heterogeneous integration challenges and solutions for silicon-based and compound semiconductor materials

Heterogeneous Integration Process Technology and Research Progress

Application of Advanced Packaging and Interconnection Technologies in Heterogeneous Integration

Research on Homogeneous/Heterogeneous Integration Interface Engineering and Reliability in Heterogeneous Technology Integration

Application and Prospect of Heterogeneous Integration Technology in Emerging Fields such as 5G, Communication and Optoelectronics, and Internet of Things

Parallel Forum 9

From the innovation of neuromorphic computing materials and devices, to the design of brain like computing architectures and chips, and to the development of integrated sensing, memory, and computing devices, breakthroughs in these fields not only significantly improve computing efficiency and energy efficiency, but also provide possibilities for realizing more intelligent and flexible information processing systems.

Neuromorphic Computing Materials and Devices

Brain like computing architecture and chips

Sensing storage computing integrated device

Integrated storage and computing AI acceleration

Parallel Forum 10

Advanced semiconductor testing technology is an important guarantee for promoting semiconductor research and production, especially for advanced processes and compound semiconductor manufacturing processes, which have raised higher requirements for testing technology. This forum will focus on the progress of advanced analytical testing technology and the localization process of equipment, covering advanced semiconductor testing technology and equipment, semiconductor material characterization analysis, device testing and reliability analysis, semiconductor ultra clean environment detection analysis, etc.

Advanced analysis and detection technology for compound semiconductors

Localization of detection and analysis equipment

Parallel Forum 11

The third-generation semiconductor devices have advantages such as high switching frequency, low on resistance, and small size, which can achieve higher system efficiency, less power loss, and smaller module size. In the application of electronic systems in aerospace, performance improvement and system weight reduction are eternal development directions. Low orbit satellite applications, aerospace applications, and high-altitude applications are important application markets for SiC and GaN semiconductor devices in the future, and are currently hot research topics. At the same time, the parameter characteristics of high frequency, high voltage, and high electric field strength have generated new demands for testing and evaluation. Failure mechanisms and actual operating conditions pose challenges to reliability verification, giving rise to new standardization gaps.

Application Analysis of Aerospace Semiconductor Devices

GaN HEMT devices and power irradiation effects

Research on Radiation Resistance of SiC Devices and Modules

Progress in International and Domestic Standards

High temperature, high frequency, and high pressure detection technology